Suzhou Beipin has long specialized in the R&D, production, sales, and service of high-precision laser micromachining equipment.

中文版

Contact Us

Building B, Gold Land Smart Manufacturing Park No. 55 Shengchuang Road, Kunshan, Jiangsu, China

Glass Cutting and Breaking All-in-One Machine

  • Machine Model: #BP-CUTTING
  • Stock: In Stock & Customizable

Contact Customer Service

Widely used in fields such as the 3C industry, mobile phone industry, instrument panels, display panels, sapphire processing, watches, wear-resistant screens, electronic components, and the semiconductor industry.Model: BP-CUTTINGPower50/70wLaser Wavelength1064 (nm)Operation ModePulse/ContinuousPosi...

  • Utilizes picosecond new technology for rapid cutting of transparent materials such as sapphire and glass
  • Optical system employs imported lenses to ensure high-quality optical transmission
  • High dimensional accuracy, minimal edge chipping, no debris
  • Optional automated loading and unloading system (dual platform)

Widely used in fields such as the 3C industry, mobile phone industry, instrument panels, display panels, sapphire processing, watches, wear-resistant screens, electronic components, and the semiconductor industry.

Model: BP-CUTTING
Power50/70w
Laser Wavelength1064 (nm)
Operation ModePulse/Continuous
Positioning Accuracy±3um
Cooling MethodWater-cooled
Cutting Kerf Width0.02-0.1mm
Minimum Aperture0.2-1.5mm
Cutting Area400*400mm
Power Supply380V±10%, 50Hz
Weight1500KG