Glass Cutting and Breaking All-in-One Machine
- 机器型号: #BP-CUTTING
- 库存: 现货可定制
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Widely used in fields such as the 3C industry, mobile phone industry, instrument panels, display panels, sapphire processing, watches, wear-resistant screens, electronic components, and the semiconductor industry.Model: BP-CUTTINGPower50/70wLaser Wavelength1064 (nm)Operation ModePulse/ContinuousPosi...
- Utilizes picosecond new technology for rapid cutting of transparent materials such as sapphire and glass
- Optical system employs imported lenses to ensure high-quality optical transmission
- High dimensional accuracy, minimal edge chipping, no debris
- Optional automated loading and unloading system (dual platform)
Widely used in fields such as the 3C industry, mobile phone industry, instrument panels, display panels, sapphire processing, watches, wear-resistant screens, electronic components, and the semiconductor industry.
| Model: BP-CUTTING | |
|---|---|
| Power | 50/70w |
| Laser Wavelength | 1064 (nm) |
| Operation Mode | Pulse/Continuous |
| Positioning Accuracy | ±3um |
| Cooling Method | Water-cooled |
| Cutting Kerf Width | 0.02-0.1mm |
| Minimum Aperture | 0.2-1.5mm |
| Cutting Area | 400*400mm |
| Power Supply | 380V±10%, 50Hz |
| Weight | 1500KG |
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